Panasonic Network Card MAZC062D User Manual

This product complies with the RoHS Directive (EU 2002/95/EC).  
ESD Diodes  
MAZC062D  
Silicon planar type  
Unit: mm  
For surge absorption circuit  
+0.10  
–0.05  
0.40  
3
+0.10  
0.16  
–0.06  
Features  
Low joint capacity zener diode  
Two elements anode-common type  
1
2
(0.95) (0.95)  
1.9 0.1  
+0.20  
Absolute Maximum Ratings Ta = 25°C  
2.90  
–0.05  
Parameter  
Repetitive peak forward current  
Power dissipation*  
Symbol  
IFRM  
PD  
Rating  
200  
Unit  
mA  
mW  
°C  
10˚  
200  
Junction temperature  
Storage temperature  
Tj  
150  
1: Cathode 1  
2: Cathode 2  
3: Anode  
Tstg  
55 to +150  
°C  
EIAJ: SC-59  
Mini3-G1 Package  
Note) : Ptot = 200 mW achieved with a printed circuit board.  
*
Marking Symbol: 6.2C  
Internal Connection  
3
2
1
Electrical Characteristics Ta = 25°C 3°C  
Parameter  
Forward voltage  
Symbol  
VF  
Conditions  
Min  
Typ  
Max  
1.0  
6.5  
100  
Unit  
V
IF = 10 mA  
0.9  
Zener voltage*  
VZ  
IZ = 5 mA  
IZ = 0.5 mA  
IZ = 5 mA  
VR = 5.5 V  
5.9  
V
Zener rise operating resistance  
Zener operating resistance  
Reverse current  
RZK  
RZ  
30  
8
IR  
3
µA  
Terminal capacitance  
Ct  
VR = 0 V, f = 1 MHz  
pF  
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.  
2. Absolute frequency of input and output is 5 MHz  
3. Electrostatic breakdown voltage: 15 kV  
Test method: IEC-801 (C = 150 pF, R = 330 , Contact discharge: 10 times)  
Test unit: ESS-200AX  
4. : The V value is for the temperature of 25°C. In other cases, carry out the temperature compensation.  
*
Z
Guaranteed at 20 ms after power application.  
Publication date: March 2004  
SKE00009CED  
1
 
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other  
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other  
company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office  
equipment, communications equipment, measuring instruments and household appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support  
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-  
ucts may directly jeopardize life or harm the human body.  
Any applications other than the standard applications intended.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita  
Electric Industrial Co., Ltd.  
 

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